Core Performance & Key Specifications

Processors

• Supports dual Intel® Xeon® 6 Scalable Processors, with up to 144 cores per socket and 3.9 GHz max clock speed.
• Up to 112.5 MB L3 cache per CPU, delivering 2x average general compute performance vs. previous generations.
• Optimized for multi-threaded applications, AI/ML, and high-performance computing (HPC) workloads.

Memory

• 32 DDR5 DIMM slots (8 channels per CPU), supporting up to 8 TB TruDDR5 memory at 6400 MT/s.
• Supports RDIMM/LRDIMM/3DS RDIMM for high density and bandwidth, ideal for in-memory databases and high VM density.

Storage Flexibility

• Front bays:
  • Up to 24 × 2.5” SAS/SATA HDDs/SSDs
  • Up to 36 × EDSFF E3.S NVMe SSDs for ultra-low-latency storage
• Rear bays: Optional 2–6 × 2.5” SFF drives for additional capacity.
• Internal: 2 × M.2 SATA/NVMe SSDs (hot-swappable, RAID support).
• RAID: 0/1/5/10/50/60 with HPE MR216/416/408 controllers; optional cache protection.

Networking & Expansion

• OCP 3.0: 2 slots (front/rear) supporting 1Gb/10Gb/25Gb/100Gb/200Gb NICs or 56G FDR IB ports.
• PCIe: Up to 8 × PCIe Gen5 slots for RAID, NIC, GPU, or FPGA accelerators.
• GPU Support: Up to 8 × single-width (75W) or 3 × double-width (300W) GPUs for AI/ML and HPC.

Advanced Management & Security

1. Intelligent Management

• HPE iLO 7: Dedicated management engine with HTML5 KVM, virtual media, and Redfish/SNMP/IPMI 2.0 support.
• HPE Compute Ops Management: Cloud-based automation for global visibility, firmware updates, and lifecycle management.
• HPE OneView: Unified infrastructure management for simplified deployment and monitoring.

2. Next-Level Security

• Silicon Root of Trust: Hardware-based security to prevent firmware tampering and cyberattacks.
• TPM 2.0: Embedded for secure boot, data encryption, and compliance.
• Intrusion Detection & Bezel Lock: Physical security options to protect against unauthorized access.

3. Efficiency & Reliability

• Dual Cooling Options: High-efficiency air cooling or Direct Liquid Cooling (DLC) to reduce energy use by up to 40%.
• 80 Plus Platinum/Titanium PSUs: 800W–2200W AC/DC, 1+1 redundancy; hot-swappable.
• Hot-Pluggable Components: Redundant fans, PSUs, and drives for non-disruptive maintenance.
• Operating Temperature: 5°C to 45°C (ASHRAE A3/A4 compliant) for data center flexibility.

Typical Applications

• AI/ML & HPC: GPU acceleration + NVMe storage for deep learning and scientific computing.
• Cloud & Virtualization: High VM density with DDR5 memory and 100/200GbE networking.
• Enterprise Databases: Oracle, SQL Server, MySQL with in-memory scaling and low-latency NVMe.
• Big Data & Analytics: Hadoop/Spark clusters with massive storage scalability.
• 5G & Edge: Low-latency processing for telecom and edge computing workloads.

Summary